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DA9276.003 13 July, 2006
MAS9276
IC for 10.00 - 30.00 MHz VCTCXO
* * * * * *
DESCRIPTION
MAS9276 is integrated circuit well suited to build VCTCXO for mobile communications. Temperature calibration is achieved at three calibration temperatures only. The trimming is done through a serial bus and the calibration information is stored in an internal PROM. This means that no rework for trimming is needed. To build a VCTCXO only a crystal is required in addition to MAS9276. The compensation method is fully analog, working continuously without generating any steps or other interference.
Very High Control Voltage Sensitivity True Sinewave Output Electrically Trimmable Very Low Phase Noise Low Power Low Cost
FEATURES
* * * * * Very small size Minimal current consumption Wide operating temperature range Phase noise <-120 dBc/Hz at 100 Hz offset Programmable Vc sensitivity
APPLICATIONS
* * VCTCXO for mobile phones VCTCXO for other telecommunications systems
BLOCK DIAGRAM
DA CLK PV VC
CUB INF SENS LIN
4 4
f(T)
MAS9276
TE1
4
f(T)
8
T
Vref
TMux
TE2
CDAC1
8
VDD OUT VSS X2 X1
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DA9276.003 13 July, 2006
PIN DESCRIPTION
Pin Description Power Supply Voltage Programming Input Serial Bus Clock Input Serial Bus Data Input Temperature Output Test Multiplexer Output Voltage Control Input Crystal Oscillator Output Crystal/Varactor Oscillator Input Power Supply Ground Buffer Output Symbol VDD PV CLK DA TE1 TE2 VC X1 X2 VSS OUT x-coordinate 166 420 979 1234 1488 1742 185 439 1357 1790 2046 y-coordinate 1430 1435 1441 1441 1441 1441 153 149 149 166 153
Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all component assembly are recommended to be performed in ESD protected area. Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The coordinates may vary depending on sawing width and location, however, distances between pads are accurate.
ABSOLUTE MAXIMUM RATINGS
(test conditions)
Parameter Supply Voltage Input Voltage Power Dissipation Storage Temperature Note 1: Not valid for programming pin PV
Symbol VDD - VSS VIN PMAX TST
Min -0.3 VSS -0.3 -55
Max 6.0 VDD + 0.3 20 150
Unit V V mW o C
Note 1)
RECOMMENDED OPERATION CONDITIONS
Parameter Supply Voltage Supply Current Operating Temperature Storage Temperature Crystal Pulling Sensitivity Crystal Load Capacitance Symbol VDD ICC TC TS S CL Conditions Vdd = 2.8 Volt Relative humidity = 15%...70% -30 -5 30 10 Min 2.7 Typ 2.8 Max 5.5 1.8 +85 +40 Unit V mA o C o C ppm/pF pF Note
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DA9276.003 13 July, 2006
ELECTRICAL CHARACTERISTICS
Parameter Frequency Range Voltage Control Range Frequency vs. Supply Voltage Frequency vs. Load Change Voltage Control Sensitivity (VCR = 0) Voltage Control Sensitivity (VCR = 1) Output Voltage (10k // 10 pF) Compensation Range 2.5 ppm Compensation Range 2.0 ppm Compensation Range Linear Part Compensation Inflection Point Compensation Range Cubic Part Compensation CDAC1 (8 Bit) Start up Time Symbol fo VC dfo dfo VCSENS VCSENS Vout TC TC a1 INF a3 CX1 TSTART C10 2 -30 -25 -0.7 25 95 C10 + 18 11 5 1.0 85 75 0.0 31 Min 10.00 0 Typ Max 30.00 Vdd 0.2 0.2 25 11 ppm ppm ppm/V ppm/V Vpp
o o
Unit MHz
Note
1) 2) 3)
C C C 4)
ppm/K
o
ppm2/K3 pF ms
Note 1: VDD within +/- 5% Note 2: R = 10 kohm +/- 10%, C = 10 pF +/- 10% Note 3: default Note 4: typ C10 = 13 pF
IC OUTLINES
VDD
PV
CLK
DA
TE1
TE2
MAS9276
1584 m
VC
X1
X2
VSS
OUT
Die map reference
2204 m
Note 1: MAS9276 pads are round with 80 m diameter at opening. Note 2: Pins CLK and DA can either be connected to VSS or left floating, pin PV can either be connected to VDD or left floating and pin TE1 must be left floating in VCTCXO module end-user application. Note 3: Die map reference is the actual left bottom corner of the sawn chip.
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DA9276.003 13 July, 2006
SAMPLES IN SB20 DIL PACKAGE
1 2 3
20OUT 19 18GND 17
TE2 4
MAS9276 YYWW XXXXX.X
TE1 5 DA 6 CLK 7 PV 8 VDD 9
10
16X2 15 14X1 13 12VC 11
Top marking: YYWW = Year, Week XXXXX.X = Lot number
DEVICE OUTLINE CONFIGURATION
MSOP10 TE2 DA CLK PV VDD OUT VSS X2 X1 VC Top View
A = product version X = voltage version Y = year WW= week
9276 AX YWW
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DA9276.003 13 July, 2006
PACKAGE (MSOP-10) OUTLINE
e S See Detail A c B E1 E1 B E E 5-15 Degrees L1 Detail A A2 A A1 D L G
Symbol Min Nom Max Unit
c1 b1 (b) Section B - B
A A 0 - 8 Degrees Gauge Plane L2 Seating Plane
F
Land Pattern Recommendation
N M
A A1 A2 b b1 c c1 D E E1 e F G L (Terminal length for soldering) L1 L2 M N S
-0.00 0.75 0.15 0.15 0.08 0.08
--0.85 ----
1.10 0.15 0.95 0.30 0.25 0.23 0.18
0.40
3.00 BSC 4.90 BSC 3.00 BSC 0.50 BSC 4.8 0.50 0.60
0.80
mm mm mm mm mm mm mm mm mm mm mm mm mm mm
0.95 REF 0.25 BSC 0.41 1.02 0.50
mm mm mm Mm
Dimensions do not include mold or interlead flash, protrusions or gate burrs. Reference Standard : JEDEC MO-187 BA.
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DA9276.003 13 July, 2006
SOLDERING INFORMATION
Resistance to Soldering Heat Maximum Temperature Maximum Number of Reflow Cycles Reflow profile Seating Plane Co-planarity Lead Finish According to RSH test IEC 68-2-58/20 2*220C 240C 2 Thermal profile parameters stated in JESD22-A113 should not be exceeded. http://www.jedec.org max 0.08 mm Solder plate 7.62 - 25.4 m, material Sn 85% Pb 15%
EMBOSSED TAPE SPECIFICATIONS
P1 P2
E W F
PO
DO
T
BO
AO
User Direction of Feed
A
D1
Section A-A
KO
Pin 1 Designator
Dimension
Min/Max
Unit
Ao Bo Do D1 E F Ko Po P1 P2 T W
5.00 0.10 3.20 0.10 1.50 +0.1/-0.0 1.50 min 1.75 5.50 0.05 1.45 0.10 4.0 8.0 0.10 2.0 0.05 0.3 0.05 12.00 +0.30/-0.10
mm mm mm mm mm mm mm mm mm mm mm mm 6 (8)
DA9276.003 13 July, 2006
REEL SPECIFICATIONS
W2
A
D B
Tape Slot for Tape Start
C
N
W1
5000 Components on Each Reel Reel Material: Conductive, Plastic Antistatic or Static Dissipative Carrier Tape Material: Conductive Cover Tape Material: Static Dissipative
Carrier Tape Cover Tape End
Start
Trailer
Dimension Min
Components
Max
Leader
Unit
A B C D N W 1 (measured at hub) W 2 (measured at hub) Trailer Leader
330 1.5 12.80 20.2 50 12.4 160 390, of which minimum 160 mm of empty carrier tape sealed with cover tape 1500 13.50
14.4 18.4
mm mm mm mm mm mm mm mm mm
Weight
g
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DA9276.003 13 July, 2006
ORDERING INFORMATION
Product Code Product Package Size
MAS9276A1TG00 MAS9276A1SM06
IC FOR VCTCXO IC FOR VCTCXO
EWS Tested wafers 215 m MSOP-10/Top Marking A1
Die Size 2.204 x 1.584 mm Tape & Reel, 5.000 pcs/reel
Contact Micro Analog Systems Oy for other wafer thickness options.
LOCAL DISTRIBUTOR
MICRO ANALOG SYSTEMS OY CONTACTS
Micro Analog Systems Oy Kamreerintie 2, P.O. Box 51 FIN-02771 Espoo, FINLAND Tel. +358 9 80 521 Fax +358 9 805 3213 http://www.mas-oy.com
NOTICE Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification.
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